IEC-61189-2 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC-61189-2
-
2ND EDITION
-
CURRENT
-- See the following:
IEC-61189-2-1
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Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61189-2 Ed. 2.0 en:2006
Revision Level
2ND EDITION
Status
Current
Publication Date
May 1, 2006
Committee Number
91