IEC-60749-22 › Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC-60749-22 - 1ST EDITION - CURRENT


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Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
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Document Number

IEC 60749-22 Ed. 1.0 b:2002

Revision Level

1ST EDITION

Status

Current

Publication Date

Sept. 1, 2002

Committee Number

47