IEC-60749-20-RL › Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

IEC-60749-20-RL - EDITION 3.0 - CURRENT



Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat


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Document Number

S+ IEC 60749-20 Ed. 3.0 en:2020 (Redline version)

Revision Level

EDITION 3.0

Status

Current

Publication Date

Aug. 1, 2020

Page Count

88 pages