IEC-60749-20-1-RL › Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC-60749-20-1-RL
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EDITION 2.0
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CURRENT
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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31.080.01 (Semiconductor devices in general)
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Document Number
S+ IEC 60749-20-1 Ed. 2.0 en:2019 (Redline version)
Revision Level
EDITION 2.0
Status
Current
Publication Date
June 1, 2019
Page Count
128 pages