IEC-60749-19-AM1 › Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Document Number
IEC 60749-19 Amd.1 Ed. 1.0 b:2010
Revision Level
1ST EDITION AMENDMENT 1
Status
Superseded
Publication Date
July 1, 2010
Committee Number
47