IEC-60749-14 › Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

IEC-60749-14 - 1ST EDITION - CURRENT


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Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
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Document Number

IEC 60749-14 Ed. 1.0 b:2003

Revision Level

1ST EDITION

Status

Current

Publication Date

Aug. 1, 2003

Committee Number

47