IEC-60191-6-8 › Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
IEC-60191-6-8
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1ST EDITION
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CURRENT
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IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
IEC 60191-6-8 Ed. 1.0 b:2001
Revision Level
1ST EDITION
Status
Current
Publication Date
Aug. 1, 2001
Committee Number
47D