IEC-60191-6-4 › Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC-60191-6-4
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1ST EDITION
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CURRENT
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IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
IEC 60191-6-4 Ed. 1.0 b:2003
Revision Level
1ST EDITION
Status
Current
Publication Date
June 1, 2003
Committee Number
47D