IEC-60191-6-3 › Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
IEC-60191-6-3
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1ST EDITION
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CURRENT
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IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
IEC 60191-6-3 Ed. 1.0 b:2000
Revision Level
1ST EDITION
Status
Current
Publication Date
Sept. 1, 2000
Committee Number
47D