IEC-60191-6-2 › Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC-60191-6-2 - 1ST EDITION - CURRENT


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 1ST EDITION - Dec. 1, 2001
 1ST EDITION CORRIGENDUM 1 - Oct. 1, 2002

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
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Document Number

IEC 60191-6-2 Ed. 1.0 b:2001

Revision Level

1ST EDITION

Status

Current

Publication Date

Dec. 1, 2001

Committee Number

47D