IEC-60191-6-19 › Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

IEC-60191-6-19 - EDITION 1.0 - CURRENT


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IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
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Document Number

IEC 60191-6-19 Ed. 1.0 b:2010

Revision Level

EDITION 1.0

Status

Current

Publication Date

Feb. 1, 2010

Committee Number

47D