IEC-60191-6-18 › Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC-60191-6-18
-
EDITION 1.0
-
CURRENT
Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Included in this current edition are the following subparts:
EDITION 1.0 - Jan. 1, 2010
ED 1.0 CORRIGENDUM 1 - May 1, 2010
ED 1.0 CORRIGENDUM 2 - July 1, 2010
ED 1.0 CORRIGENDUM 1 - May 1, 2010
ED 1.0 CORRIGENDUM 2 - July 1, 2010
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Document Number
IEC 60191-6-18 Ed. 1.0 b:2010
Revision Level
EDITION 1.0
Status
Current
Publication Date
Jan. 1, 2010
Committee Number
47D