IEC-60191-6-17 › Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

IEC-60191-6-17 - EDITION 1.0 - CURRENT


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IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
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Document Number

IEC 60191-6-17 Ed. 1.0 b:2011

Revision Level

EDITION 1.0

Status

Current

Publication Date

Jan. 1, 2011

Committee Number

47D