IEC-60191-6-1 › Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

IEC-60191-6-1 - 1ST EDITION - CURRENT


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Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
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31.080.01 (Semiconductor devices in general)

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Document Number

IEC 60191-6-1 Ed. 1.0 en:2001

Revision Level

1ST EDITION

Status

Current

Publication Date

Oct. 1, 2001

Committee Number

47D