IEC-2326-4-1 › Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
IEC-2326-4-1
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1ST EDITION
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CURRENT
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Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.
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31.180 (Printed circuits and boards)
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Document Number
IEC 62326-4-1 Ed. 1.0 b:1996
Revision Level
1ST EDITION
Status
Current
Publication Date
Dec. 1, 1996
Committee Number
91