IEC-2326-4 › Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC-2326-4 - 1ST EDITION - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.
ORDER

Price:

$293.91        


Want this as a site license?

To find similar documents by classification:

31.180 (Printed circuits and boards)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

 

Customers who bought this document also bought:

MIL-STD-810
Environmental Engineering Considerations and Laboratory Tests

MIL-STD-883
Microcircuits

MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for

Document Number

IEC 62326-4 Ed. 1.0 b:1996

Revision Level

1ST EDITION

Status

Current

Publication Date

Dec. 1, 1996

Committee Number

91