EN-61189-3-719 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

EN-61189-3-719 - 2016 EDITION - CURRENT -- See the following: BS-EN-61189-3-719



Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling


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31.180 (Printed circuits and boards)

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Document Number

EN 61189-3-719:2016

Revision Level

2016 EDITION

Status

Current

Publication Date

April 8, 2016