EN-61189-11 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
To find similar documents by classification:
31.180 (Printed circuits and boards)
Document Number
EN 61189-11:2013
Revision Level
2013 EDITION
Status
Current
Publication Date
June 28, 2013