BS-IEC-63055 › Format for LSI-Package-Board Interoperable design

BS-IEC-63055 - 2023 EDITION - CURRENT
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Format for LSI-Package-Board Interoperable design

Keywords

Electromagnetic compatibility;Electronic equipment and components;Emission;Electric terminals;Printed-circuit boards;Electromagnetic fields;Integrated circuits;Noise (spurious signals);Electrical conductance;Simulation;Mathematical models

To find similar documents by classification:

31.180 (Printed circuits and boards)

31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

35.060 (Languages used in information technology)

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Document Number

BS IEC 63055:2023

Revision Level

2023 EDITION

Status

Current

Publication Date

Nov. 8, 2023

Replaces

BS IEC 63055:2016

Page Count

298

ISBN

9780539278408

International Equivalent

IEC 63055 ED.2

Committee Number

EPL/501