BS-IEC-61189-5-4 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

BS-IEC-61189-5-4 - 2015 EDITION - CURRENT


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Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Keywords

Printed circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis and testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials)

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

BS IEC 61189-5-4:2015

Revision Level

2015 EDITION

Status

Current

Publication Date

Jan. 31, 2015

Page Count

26

ISBN

9780580812736

International Equivalent

IEC 61189-5-4:2015

Committee Number

EPL/501