BS-IEC-61189-2-804 › Test methods for electrical materials, printed board and other interconnection structures and assemblies

BS-IEC-61189-2-804 - RENUMBERED AS BS-EN-IEC-61189-2-804 - CURRENT
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Test methods for electrical materials, printed board and other interconnection structures and assemblies

Keywords

Testing methods;Electrical equipment;Electrically-conducting materials;Printed-circuit boards;Delamination;Thermo-mechanical separation

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

BS-IEC-61189-2-804

Revision Level

RENUMBERED AS BS-EN-IEC-61189-2-804

Status

Current

Publication Date

Dec. 1, 2023

International Equivalent

EN 61189-2-804 Ed.1.0;IEC 61189-2-804 Ed.1.0

Committee Number

EPL/501