BS-IEC-61189-2-801 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies.
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies.
Keywords
Performance;Thermal conductivity;Structures;Printing board;Test methods
To find similar documents by classification:
31.180 (Printed circuits and boards)
Document Number
BS-IEC-61189-2-801
Revision Level
RENUMBERED AS BS-EN-IEC-61189-2-801
Status
Current
Publication Date
Dec. 1, 2023
International Equivalent
EN 61189-2-801:2023;IEC 61189-2-801 Ed.1.0
Committee Number
EPL/501