BS-EN-IEC-63251 › Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
BS-EN-IEC-63251
-
2023 EDITION
-
CURRENT
Document Center Inc. is an authorized dealer of BSI standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Keywords
Test methods;Printed-circuit boards;Stress;Thermal stress;Reliability;Assessed reliability
To find similar documents by classification:
31.180 (Printed circuits and boards)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Document Number
BS EN IEC 63251:2023
Revision Level
2023 EDITION
Status
Current
Publication Date
Dec. 19, 2023
Page Count
26
ISBN
9780539052060
International Equivalent
EN 63251 Ed.1.0;IEC 63251 Ed.1.0
Committee Number
EPL/501