BS-EN-IEC-61189-2-808 › Test methods for electrical materials, printed board and other interconnection structures and assemblies
BS-EN-IEC-61189-2-808
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2024 EDITION
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CURRENT
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Test methods for electrical materials, printed board and other interconnection structures and assemblies
Keywords
Testing methods;Electrical connections;Electrical conductivity;Electrically-conducting materials;Printing board;Thermal resistance;Thermal behaviour of structures
To find similar documents by classification:
31.180 (Printed circuits and boards)
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Document Number
BS EN IEC 61189-2-808:2024
Revision Level
2024 EDITION
Status
Current
Publication Date
June 4, 2024
Page Count
26
ISBN
9780539155082
International Equivalent
EN 61189-2-808 Ed.1.0;IEC 61189-2-808 Ed.1.0
Committee Number
EPL/501