BS-EN-IEC-61189-2-804 › Test methods for electrical materials, printed board and other interconnection structures and assemblies
BS-EN-IEC-61189-2-804
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2023 EDITION
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CURRENT
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Included in this current edition are the following subparts:
2023 EDITION - Aug. 30, 2023
2023 EDITION CORRIGENDUM 1 - Dec. 1, 2023
2023 EDITION CORRIGENDUM 1 - Dec. 1, 2023
Keywords
Thermo-mechanical separation;Delamination;Printed-circuit boards;Electrically-conducting materials;Electrical equipment;Testing methods
To find similar documents by classification:
31.180 (Printed circuits and boards)
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Document Number
BS EN IEC 61189-2-804:2023
Revision Level
2023 EDITION
Status
Current
Publication Date
Dec. 25, 2023
Page Count
14
ISBN
9780539298079
International Equivalent
IEC 61189-2-804:2023;EN IEC 61189-2-804:2023
Committee Number
EPL/501