BS-EN-61190-1-2 › Historical Revision Information
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

BS-EN-61190-1-2 - 2007 EDITION - SUPERSEDED
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Attachment materials for electronic assembly

Keywords

Quality control;Bonding;Quality assurance;Solders;Electronic equipment and components;Electrical connections;Pastes;Soldering;Electronic engineering;Classification systems;Soldered connectors

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 61190-1-2:2007

Revision Level

2007 EDITION

Status

Superseded

Publication Date

July 31, 2007

Replaces

BS EN 61190-1-2:2002

Replaced By

BS EN 61190-1-2:2014

Page Count

22

ISBN

9780580553363

International Equivalent

EN 61190-1-2:2007;IEC 61190-1-2:2007;EN 60191-4:1999/A1:2002

Committee Number

EPL/501