BS-EN-60249-2-3 › Metal-Clad Base Materials for Printed Wiring Boards. Copper-Clad Base Material. Specif

BS-EN-60249-2-3 - AMD 11049 - SUPERSEDED
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Metal-Clad Base Materials for Printed Wiring Boards. Copper-Clad Base Material. Specif


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31.180 (Printed circuits and boards)

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Document Number

BS-EN-60249-2-3

Revision Level

AMD 11049

Status

Superseded

Publication Date

April 1, 2001