BS-CECC-23800-801 › Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

BS-CECC-23800-801 - 1998 EDITION - CURRENT


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Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

Keywords

Printed-circuit boards, Printed circuits, Electronic equipment and components, Electrical equipment, Electrical components, Assessed quality, Quality assurance systems, Capability approval, Approval testing, Detail specification, Specification (approval), Finishes, Surface treatment, Metal coatings, Organic coatings, Designations, Inspection, Defects, Dimensional measurement, Visual inspection (testing), Bonding, Thickness, Electrical testing, Resistance measurement, Electrical insulation, Contaminants, Mechanical testing, Porosity measurement, Solderability testing, Conformity, Ageing tests, Specimen preparation, Edge socket connectors, Holes, Preferred sizes

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

BS CECC 23800-801:1998

Revision Level

1998 EDITION

Status

Current

Publication Date

June 15, 1998

Page Count

24

ISBN

0580298892

International Equivalent

CECC 23800-801:1998

Committee Number

EPL/501