BS-CECC-23600-801 › Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

BS-CECC-23600-801 - 1998 EDITION - CURRENT


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Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

Keywords

Conformity;Approval testing;Electronic equipment and components;Detail specification;Porosity measurement;Electrical components;Organic coatings;Electrical testing;Designations;Metal coatings;Edge socket connectors;Finishes;Preferred sizes;Solderability testing;Assessed quality;Electrical equipment;Laminates;Dimensional measurement;Inspection;Visual inspection (testing);Quality assurance systems;Surface treatment;Specification (approval);Thickness;Electrical insulation;Printed circuits;Holes;Printed-circuit boards;Defects;Mechanical testing;Multiple;Contaminants;Acceptance (approval);Ageing tests;Bonding;Resistance measurement;Specimen preparation;Capability approval

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31.180 (Printed circuits and boards)

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Document Number

BS CECC 23600-801:1998

Revision Level

1998 EDITION

Status

Current

Publication Date

June 15, 1998

Page Count

24

ISBN

0580298906

International Equivalent

CECC 23600-801:1998

Committee Number

EPL/501