BS-4584-103.1 › Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
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31.180 (Printed circuits and boards)
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Document Number
BS 4584-103.1:1990
Revision Level
1990 EDITION
Status
Superseded
Publication Date
Feb. 28, 1990
Page Count
12 pages