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Scope

1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package.

1.2 This test method covers a test for leaks in a package that is intended to be hermetically sealed after hybrid circuit assembly. Various types of hybrid packages may be tested by this test method. The test method is nondestructive and therefore suitable for 100% inspection.

1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety problems associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

Hermeticity test methods, for example, Test Methods F 134, deal with sealed packages only and do not apply directly to unsealed packages. This test method is most applicable for determining the hermeticity of a package before it has been sealed with a lid or a cover. Packages that are intended for hermetic seal use are manufactured so as to prevent leakage of helium at a rate in excess of 1 × 10 ⁻⁸ atm cc/s under a pressure differential of 1 atm when tested on a helium mass spectrometer leak detector. This test should be conducted in a clean work area such as would be provided by a laminar flow clean bench as specified in Fed. Std. No. 209. This test method is not recommended for use in commerce until the precision has been determined.

Acceptance and rejection criteria for this test method shall be agreed upon by the purchaser and the supplier as part of the purchase contract.

Note 1—Packages that are not capable of meeting a maximum leak rate of 1 × 10 ⁻⁸ atm cc/s of helium at a pressure differential of 1 atm are customarily rejected on the basis that good quality assurance is achieved with this performance level.

Keywords

helium leak testing; hermetic packages; hybrid microcircuits; ICS Number Code 55.180.40 (Complete, filled transport packages)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

55.180.40 (Complete, filled transport packages Including reusable packages and unit loads)

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