ASTM-F775 › Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
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Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
Keywords
ICS Number Code 29.045 (Semiconducting materials)
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
29.045 (Semiconducting materials)
31.080.01 (Semiconductor devices in general)
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Document Number
ASTM-F775-88
Revision Level
1988 EDITION
Status
Cancelled
Modification Type
Withdrawn
Publication Date
Oct. 31, 1988
Document Type
Test Method
Page Count
7 pages