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Scope

1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.

1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.

1.3 This test method applies to all films that can be soldered.

1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.

1.5 This test method is destructive.

1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond is often the adhesion of the soldered film to the substrate.

This test method can be used for material selection, process development, research in support of improved yield or reliability, and specification for material procurement.

It is not recommended that this test method be used in deciding questions between buyers and sellers until the precision of the method has been determined by interlaboratory comparison.

Keywords

adhesion strength; metallization; solderable thick film; ICS Number Code 25.160.50 (Brazing and soldering)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)

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