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Scope

1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.

1.2 These test methods appear in the following sections:

Test Sections Compressive Creep 4 to 10 Dielectric Strength 38 to 41 Mica or Binder Content 19 Molding Test 31 to 37 Organic Binder 20 to 24 Resistivity 42 to 46 Silicone Binder 25 to 30 Stability Under Heat and Pressure 11 to 18

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See Notes 3 and 5 and 38.1 and 43.1 for specific hazard statements.

1.4 The values stated in inch-pound units are to be regarded as the standard.

Keywords

binder content; bonded mica paper; bonded mica splittings; commutator segment insulation; compressive creep; heater plates; pasted mica

To find similar documents by ASTM Volume:

10.01 (Electrical Insulation (I): D69 - D2484)

To find similar documents by classification:

29.035.50 (Mica based materials)

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