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1.1 This test method permits the rapid measurement of apparent relative permittivity and loss tangent (dissipation factor) of metal-clad polymer-based circuit substrates in the X-band (8 GHz to 12.4 GHz).

1.2 This test method is suitable for testing PTFE (polytetrafluorethylene) impregnated glass cloth or random-oriented fiber mats, glass fiber-reinforced polystyrene, polyphenyleneoxide, irradiated polyethylene, and similar materials having a nominal specimen thickness of ¹/₁₆ in. (1.6 mm). The materials listed in the preceding sentence have been used in commercial applications at nominal frequency of 9.6 GHz.

1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

5.1 Permittivity and dissipation factor are fundamental design parameters for design of microwave circuitry. Permittivity plays a principal role in determining the wavelength and the impedance of transmission lines. Dissipation factor (along with copper losses) influence attenuation and power losses.

5.2 This test method is suitable for polymeric materials having permittivity in the order of two to eleven. Such materials are popular in applications of stripline and microstrip configurations used in the 1 GHz to 18 GHz range.

5.3 This test method is suitable for design, development, acceptance specifications, and manufacturing quality control.