ASTM-B885 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

ASTM-B885 - 2009 R20 EDITION - CURRENT
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Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
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Scope

1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

1.2 Practice B 667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B 667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

contact resistance; contamination; edgecard connector; printed wiring board fingers

To find similar documents by ASTM Volume:

02.04 (Nonferrous Metals--Nickel, Cobalt, Lead, Tin, Zinc, Cadmium, Precious, Reactive, Refractory Metals and Alloys; Materials for Thermostats, Electrical Heating and Resistance Contacts, and Connectors)

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

ASTM-B0885-09R20

Revision Level

2009 R20 EDITION

Status

Current

Modification Type

New

Publication Date

Oct. 23, 2020

Document Type

Test Method

Page Count

3 pages

Committee Number

B02.11