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Scope

1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.

1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.

1.3 This specification is not intended for electrodeposited copper when used for electroforming.

Keywords

Copper-electrodeposited coatings; Electrodeposited coatings

To find similar documents by ASTM Volume:

02.05 (Metallic and Inorganic Coatings; Metal Powders and Metal Powder Products)

To find similar documents by classification:

25.220.40 (Metallic coatings Including electrolytic depositions, cathodic coatings, autocatalytic coatings, etc.)

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